Total Processing & Packaging 2010 has increased its floor space for a second time as companies continue to sign up for the UK’s largest processing and packaging exhibition. Due to the high level of demand, organisers Reed Exhibitions have now made another 745.5m² available.
The first allocation of additional space that was released at the start of the year has already been filled and has led to the doubling in size of the Packaging Innovation Hub, which will focus on packaging materials, containers, pack design and marketing, smart and intelligent packaging, and sustainable solutions. Leading names taking stands in the Hub include Artenius PET Packaging, Avery Denison, BCP Fluted Packaging, Clarke Rubicon, Plastique, Sleeve Solutions and Tinplate Products.
Another significant development resulting from the increased floor area is the brand new Robotics & Industrial Vision Pavilion in association with BARA and UKIVA. The Pavilion will showcase the latest technology solutions that enable businesses to increase productivity while also delivering efficiency savings.
“We are delighted at the strong exhibitor take-up for Total Processing & Packaging,” comments Group Exhibition Director Ian Crawford. “It is clear that although the economic situation remains tough, many companies are realising that there is still business to be had and that it is therefore important to promote themselves as effectively as possible and put themselves in front of their prospective customers.
“Since last year’s highly successful PPMA show we have definitely seen an up-turn in the processing & packaging sectors with many companies reporting strong order intake in the last quarter of 2009 and the beginning of 2010. Total Processing & Packaging is timed perfectly for these companies to take full advantage of the very positive signs, and features such as the Packaging Innovation and Interphex Hubs and the Robotics & Industrial Vision Pavilion will help to guide visitors to the companies that can offer them the right solutions to their packaging and processing requirements.”
Otros aspectos destacados de la exposición serán una serie de seminarios gratuitos dedicados tanto al Packaging Innovation como a Interphex Hubs, y Design Challenge, donde diseñadores y fabricantes de empaques y maquinaria trabajan juntos para explorar oportunidades para la creación de nuevos productos, mercado aplicaciones y experiencias del consumidor.
Total Processing & Packaging 2010 takes place at the NEC from May 25th to 27th. Visitor registration, which will enable fast entry into the exhibition on the day, is now open at www.totalexhibition.com/register. The website also contains detailed information about the exhibition, including travel and accommodation advice, and extensive corporate and product information from individual exhibitors.
Las empresas interesadas en exponer deben ponerse en contacto con Graham Earl en 020 8910 7890, correo electrónico: [Email protected].